Mitaka has been manufacturing precision instruments that are loaded with space hardware technology. And, these instruments function as “standard” in various industries. Above all, non-contact 3D measuring instruments with laser autofocus systems are disseminated widely in domestic semiconductor industry and ultraprecision processing field in Japan. And this laser autofocus system was named as “point autofocus profiling” and registered in ISO 25178 (International Standard of 3D profile and surface texture) as one of Japanese measuring technology in 2008. The point autofocus profiling is officially standardized as ISO 25178-605 (Point autofocus probe) in 2014. Mitaka continues to offer this “brand-new” technology to the world.
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Point autofocus probe 3D measuring instrument
The perfect solutions for measuring aspherical lens, LCD lgith panel, moldings, etc.
Point autofocus probe 3D form measuring instrument
A compact laser probe head and 5-axis control enable all-round contour measurements
Point autofocus probe surface texture measuring instrument
Scan autofocus (Scan AF) system offers fast measurement and has large measuring area with high accuracy in the sub-micrometer level
Laser probe application products
Offering high precision measurements on finishing machine and manufacturing line
High precision chip bonder
High precision mounting device of a vacuum suctioned chip
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Fresnel lens molding die
High precision measurement of a transparent lens with steep angles.
High speed and high precision measurements of sub-micrometer grooves.
Volume of solder
Volume and height evaluation of solder out of 3D surface.
Dicing blade warpage
High speed measurement of a circular pattern by using the Mask Measurement.
Tracking rugged lens surface.
HDD head suspension
Measurement of delicate sample which easily distorts by one gentle touch.
High-density mounting board
Fine structure in a large area.
Surface of aspherical lens molding die
Diamond turning processed surface.
High precision measurement of delicate material.
Capturing fine structure.
Unevenness of evaporated metal film
High precision measurement of nano-meter level unevenness.
Diamond abrasive grain
Cutting edge profile and projection height measurements.
Tip of turning tool
Offering 3D view, size evaluation and roughness measurement.
Enhanced functions for profile and height measurements, coplanarity evaluation, etc.
Warpage and waviness of wafer
High speed measurement of total warpage and waviness of wafer.
Oblique incidence X-ray mirror
Measuring large sample in sub-micrometer level.
Grinding work surface
Calculating areal roughness out of measuring area.
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